Bahgat G. Sammakia

Sammakia received his B.S. degree in 1977 from the University of Alexandria. He received his M.S. and Ph.D. degrees in 1980 and 1982, respectively from the State University of New York at Buffalo. All of his degrees are in mechanical engineering.[4] The title of his doctoral dissertation is "Transient natural and mixed convection flows and transport adjacent to an ice surface melting in saline water".[5]

After completing his Ph.D., Sammakia was a postdoctoral fellow at the University of Pennsylvania. He began working for IBM in 1984 as an engineer. He continued to work for IBM until 1998, holding various management positions during that time. Some of the groups that he managed at IBM include the thermal and mechanical analysis groups, the surface science group, the chemical lab, and the site technical assurance group.[6] Sammakia is a Fellow of the ASME, the IEEE and the National Academy of Inventors Sammakia won the ASME Heat Transfer Memorial Award in 2020 He was honored by the Chancellor of the State University of New York in 2002 for research excellence.[7]

Sammakia was the Vice President for Research at Binghamton University from July 2003 until July 2004.[8] Dr. Bahgat Sammakia is the interim president at SUNY Polytechnic Institute beginning November third 2016.

Sammakia was the editor of the Journal of Electronics Packaging, which is published by the American Society of Mechanical Engineers.[9]

7,282,254 Surface coating for electronic systems

6,219,234 Method for using pulsating flow to improve thermal transport in systems

6,058,015 Electronic packages and a method to improve thermal performance of electronic packages

5,966,290 Electronic packages and a method to improve thermal performance of electronic packages

5,912,800 Electronic packages and method to enhance the passive thermal management of electronic packages

5,870,285 Assembly mounting techniques for heat sinks in electronic packaging

5,491,610 Electronic package having active means to maintain its operating temperature constant

5,420,520 Method and apparatus for testing of integrated circuit chips

5,109,318 Pluggable electronic circuit package assembly with snap together heat sink housing

5,028,984 Epoxy composition and use thereof

5,003,429 Electronic assembly with enhanced heat sinking

4,914,551 Electronic package with heat spreader member

4,849,856 Electronic package with improved heat sink

• Benjamin Gebhart; Yogesh Jaluria; Roop L. Mahajan; Bahgat Sammakia (1988). Buoyancy Induced Flows and Transport. Hemisphere. ISBN 0-89116-402-2.
• Arunasalam, Parthiban; Ackler, Harold D.; Sammakia, Bahgat G. (Jul–Aug 2006). "Microfabrication of ultrahigh density wafer-level thin film compliant interconnects for through-silicon-via based chip stacks". Journal of Vacuum Science and Technology B. 24 (4): 1780–1784. Bibcode:2006JVSTB..24.1780A. doi:10.1116/1.2210003.
• Desai, Anand; Geer, James; Sammakia, Bahgat (March 2006). "Models of steady heat conduction in multiple cylindrical domains". Journal of Electronic Packaging. 128 (1): 10–17. doi:10.1115/1.2159003.
• Desai, Anand; Mahajan, Sanket; Subbarayan, Ganesh; Jones, Wayne; Geer, James; Sammakia, Bahgat (March 2006). "A numerical study of transport in a thermal interface material enhanced with carbon nanotubes". Journal of Electronic Packaging. 128 (1): 92–97. doi:10.1115/1.2161231.
• Watson, S.P.; Murray, B.T.; Sammakia, B.G. (June 2001). "Computational parameter study of chip scale package array cooling". IEEE Transactions on Components and Packaging Technologies. 24 (2): 184–190. doi:10.1109/6144.926381.
• Sathe, Sanjeev B.; Sammakia, Bahgat G. (June 2000). "A numerical study of the thermal performance of a tape ball grid array (TBGA) package". Journal of Electronic Packaging. 122 (2): 107–114. doi:10.1115/1.483141.
• Tyan-Min Niu; Sammakia, B.G.; Sathe, S. (December 1999). "Void-effect modeling of flip-chip encapsulation on ceramic substrate". IEEE Transactions on Components and Packaging Technologies. 22 (4): 484–487. doi:10.1109/6144.814962.
• Tran, S.K.; Questad, D.L.; Sammakia, B.G. (December 1999). "Adhesion issues in flip-chip on organic modules". IEEE Transactions on Components and Packaging Technologies. 22 (4): 519–524. doi:10.1109/6144.814967.
• Sathe, S.; Sammakia, B. (November 1998). "A review of recent developments in some practical aspects of air-cooled electronic packages". Journal of Heat Transfer. 120 (4): 830–839. doi:10.1115/1.2825902.

• The Integrated Electronics Engineering Center Archived 2011-09-29 at the Wayback Machine