Debendra Mallik

Debendra Mallik is an electrical engineer at Intel Corporation in Chandler, Arizona. He was named a Fellow of the Institute of Electrical and Electronics Engineers (IEEE) in 2015[1] for his contributions to microprocessor packaging.

References
  1. "2015 elevated fellow" (PDF). IEEE Fellows Directory. Archived from the original (PDF) on 2017-08-29. Retrieved 2017-04-08.


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