List of integrated circuit packaging types

Integrated circuits are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage. A very large number of different types of package exist. Some package types have standardized dimensions and tolerances, and are registered with trade industry associations such as JEDEC and Pro Electron. Other types are proprietary designations that may be made by only one or two manufacturers. Integrated circuit packaging is the last assembly process before testing and shipping devices to customers.

A standard-sized 8-pin dual in-line package (DIP) containing a 555 IC.

Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier. In flip chip systems the IC is connected by solder bumps to a substrate. In beam-lead technology, the metallized pads that would be used for wire bonding connections in a conventional chip are thickened and extended to allow external connections to the circuit. Assemblies using "bare" chips have additional packaging or filling with epoxy to protect the devices from moisture.

Through-hole packages
Main article: dual in-line package

Through-hole technology uses holes drilled through the printed circuit board (PCB) for mounting the components. The component has leads that are soldered to pads on the PCB to electrically and mechanically connect them to the PCB.

Three 14-pin (DIP14) plastic dual in-line packages containing IC chips.
AcronymFull nameRemark
SIPSingle in-line package
DIPDual in-line package0.1 in (2.54 mm) pin spacing, rows 0.3 in (7.62 mm) or 0.6 in (15.24 mm) apart.
CDIPCeramic DIP[1]
CERDIPGlass-sealed ceramic DIP[1]
QIPQuad in-line packageLike DIP but with staggered (zig-zag) pins.[1]
SKDIPSkinny DIPStandard DIP with 0.1 in (2.54 mm) pin spacing, rows 0.3 in (7.62 mm) apart.[1]
SDIPShrink DIPNon-standard DIP with smaller 0.07 in (1.78 mm) pin spacing.[1]
ZIPZig-zag in-line package
MDIPMolded DIP[2]
PDIPPlastic DIP[1]

Surface mount
See also: Surface-mount technology
AcronymFull nameRemark
CCGACeramic column-grid array (CGA)[3]
CGAColumn-grid array[3]
CERPACKCeramic package[4]
CQGP[5]
LLPLead-less lead-frame packageA package with metric pin distribution (0.5–0.8 mm pitch)[6]
LGALand grid array[3]
LTCCLow-temperature co-fired ceramic[7]
MCMMulti-chip module[8]
MICRO SMDXTMicro surface-mount device extended technology[9]

Chip on board is a packaging technique that directly connects a die to a PCB, without an interposer or lead frame.

Chip carrier
Main article: chip carrier

A chip carrier is a rectangular package with contacts on all four edges. Leaded chip carriers have metal leads wrapped around the edge of the package, in the shape of a letter J. Leadless chip carriers have metal pads on the edges. Chip carrier packages may be made of ceramic or plastic and are usually secured to a printed circuit board by soldering, though sockets can be used for testing.

AcronymFull nameRemark
BCCBump chip carrier[3]
CLCCCeramic lead-less chip carrier[1]
LCCLead-less chip carrier[3]Contacts are recessed vertically.
LCCLeaded chip carrier[3]
LCCCLeaded ceramic-chip carrier[3]
DLCCDual lead-less chip carrier (ceramic)[3]
PLCCPlastic leaded chip carrier[1][3]

Pin grid arrays
Main article: Pin grid array
AcronymFull nameRemark
OPGAOrganic pin-grid array
FCPGAFlip-chip pin-grid array[3]
PACPin array cartridge[10]
PGAPin-grid arrayAlso known as PPGA[1]
CPGACeramic pin-grid array[3]

Flat packages
Main article: Quad Flat Package
AcronymFull nameRemark
-Flat-packEarliest version metal/ceramic packaging with flat leads
CFPCeramic flat-pack[3]
CQFPCeramic quad flat-pack[1][3]Similar to PQFP
BQFPBumpered quad flat-pack[3]
DFNDual flat-packNo lead[3]
ETQFPExposed thin quad flat-package[11]
PQFNPower quad flat-packNo-leads, with exposed die-pad[s] for heatsinking[12]
PQFPPlastic quad flat-package[1][3]
LQFPLow-profile quad flat-package[3]
QFNQuad flat no-leads packageAlso called as micro lead frame (MLF).[3][13]
QFPQuad flat package[1][3]
MQFPMetric quad flat-packQFP with metric pin distribution[3]
HVQFNHeat-sink very-thin quad flat-pack, no-leads
SIDEBRAZE[14][15]
TQFPThin quad flat-pack[1][3]
VQFPVery-thin quad flat-pack[3]
TQFNThin quad flat, no-lead
VQFNVery-thin quad flat, no-lead
WQFNVery-very-thin quad flat, no-lead
UQFNUltra-thin quad flat-pack, no-lead
ODFNOptical dual flat, no-leadIC packaged in transparent packaging used in optical sensor

Small outline packages

A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs.

AcronymFull nameRemark
SOPSmall-outline package[1]
CSOPCeramic small-outline package
DSOP Dual small-outline package
HSOP Thermally-enhanced small-outline package
HSSOP Thermally-enhanced shrink small-outline package[16]
HTSSOP Thermally-enhanced thin shrink small-outline package[16]
mini-SOICMini small-outline integrated circuit
MSOPMini small-outline packageMaxim uses the trademarked name µMAX for MSOP packages
PSOPPlastic small-outline package[3]
PSONPlastic small-outline no-lead package
QSOPQuarter-size small-outline packageThe terminal pitch is 0.635 mm.[3]
SOICSmall-outline integrated circuitAlso known as SOIC NARROW and SOIC WIDE
SOJSmall-outline J-leaded package
SON Small-outline no-lead package
SSOPShrink small-outline package[3]
TSOPThin small-outline package[3]
TSSOPThin shrink small-outline package[3]
TVSOPThin very-small-outline package[3]
VSOP Very-small-outline package[16]
VSSOP Very-thin shrink small-outline package[16] Also referred as MSOP = micro small-outline package
WSONVery-very-thin small-outline no-lead package
USONVery-very-thin small-outline no-lead packageSlightly smaller than WSON

Chip-scale packages

According to IPC's standard J-STD-012, Implementation of Flip Chip and Chip Scale Technology, in order to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die and it must be a single-die, direct surface mountable package. Another criterion that is often applied to qualify these packages as CSPs is their ball pitch should be no more than 1 mm. Chip-scale package

Example WL-CSP devices sitting on the face of a U.S. penny. A SOT-23 device is shown (top) for comparison.
AcronymFull nameRemark
BL Beam lead technology Bare silicon chip, an early chip-scale package
CSPChip-scale packagePackage size is no more than 1.2× the size of the silicon chip[17][18]
TCSPTrue chip-size packagePackage is same size as silicon[19]
TDSPTrue die-size packageSame as TCSP[19]
WCSP or WL-CSP or WLCSPWafer-level chip-scale package A WL-CSP or WLCSP package is just a bare die with a redistribution layer (or I/O pitch) to rearrange the pins or contacts on the die so that they can be big enough and have sufficient spacing so that they can be handled just like a BGA package.[20]
PMCPPower mount CSP (chip-scale package)Variation of WLCSP, for power devices like MOSFETs. Made by Panasonic.[21]
Fan-out WLCSPFan-out wafer-level packagingVariation of WLCSP. Like a BGA package but with the interposer built directly atop the die and encapsulated alongside it.
eWLBEmbedded wafer level ball grid arrayVariation of WLCSP.
MICRO SMD-Chip-size package (CSP) developed by National Semiconductor[22]
COBChip on boardBare die supplied without a package. It is mounted directly to the PCB using bonding wires and covered with a blob of black Epoxy.[23] Also used for LEDs. In LEDs, transparent epoxy or a silicon caulk-like material that may contain a phosphor is poured into a mold containing the LED(s) and cured. The mold forms part of the package.
COFChip-on-flexVariation of COB, where a chip is mounted directly to a flex circuit. Unlike COB, it may not use wires nor be covered with epoxy, using underfill instead.
TABTape-automated bondingVariation of COF, where a flip chip is mounted directly to a flex circuit without the use of bonding wires. Used by LCD driver ICs.
COGChip-on-glassVariation of TAB, where a chip is mounted directly to a piece of glass - typically an LCD. Used by LCD and OLED driver ICs.

Ball grid array
Main article: Ball grid array

Ball grid array (BGA) uses the underside of the package to place pads with balls of solder in grid pattern as connections to PCB.[1][3]

AcronymFull nameRemark
FBGAFine-pitch ball-grid arrayA square or rectangular array of solder balls on one surface[3]
LBGALow-profile ball-grid arrayAlso known as laminate ball-grid array[3]
TEPBGAThermally-enhanced plastic ball-grid array
CBGACeramic ball-grid array[3]
OBGAOrganic ball-grid array[3]
TFBGAThin fine-pitch ball-grid array[3]
PBGAPlastic ball-grid array[3]
MAP-BGAMold array process - ball-grid array
UCSPMicro (μ) chip-scale packageSimilar to a BGA (A Maxim trademark example)[18]
μBGAMicro ball-grid arrayBall spacing less than 1 mm
LFBGALow-profile fine-pitch ball-grid array[3]
TBGAThin ball-grid array[3]
SBGASuper ball-grid array[3]Above 500 balls
UFBGAUltra-fine ball-grid array[3]

Transistor, diode, small-pin-count IC packages
A drawing of a ZN414 IC in a TO-18 package
  • MELF: Metal electrode leadless face (usually for resistors and diodes)
  • SOD: Small-outline diode.
  • SOT: Small-outline transistor (also SOT-23, SOT-223, SOT-323).
  • TO-XX: wide range of small pin count packages often used for discrete parts like transistors or diodes.
    • TO-3: Panel-mount with leads
    • TO-5: Metal can package with radial leads
    • TO-18: Metal can package with radial leads
    • TO-39
    • TO-46
    • TO-66: Similar shape to the TO-3 but smaller
    • TO-92: Plastic-encapsulated package with three leads
    • TO-99: Metal can package with eight radial leads
    • TO-100
    • TO-126: Plastic-encapsulated package with three leads and a hole for mounting on a heat sink
    • TO-220: Through-hole plastic package with a (usually) metal heat sink tab and three leads
    • TO-226[24]
    • TO-247:[25] Plastic-encapsulated package with three leads and a hole for mounting on a heat sink
    • TO-251:[25] Also called IPAK: SMT package similar to the DPAK but with longer leads for SMT or TH mounting
    • TO-252:[25] (also called SOT428, DPAK):[25] SMT package similar to the DPAK but smaller
    • TO-262:[25] Also called I2PAK: SMT package similar to the D2PAK but with longer leads for SMT or TH mounting
    • TO-263:[25] Also called D2PAK: SMT package similar to the TO-220 without the extended tab and mounting hole
    • TO-274:[25] Also called Super-247: SMT package similar to the TO-247 without the mounting hole

Dimension reference

Surface-mount
A general surface mount chip, with major dimensions.
A general surface mount chip, with major dimensions.
C
Clearance between IC body and PCB
H
Total height
T
Lead thickness
L
Total carrier length
LW
Lead width
LL
Lead length
P
Pitch

Through-hole
A general through-hole pin chip, with major dimensions.
A general through-hole pin chip, with major dimensions.
C
Clearance between IC body and board
H
Total height
T
Lead thickness
L
Total carrier length
LW
Lead width
LL
Lead length
P
Pitch
WB
IC body width
WL
Lead-to-lead width

Package dimensions

All measurements below are given in mm. To convert mm to mils, divide mm by 0.0254 (i.e., 2.54 mm / 0.0254 = 100 mil).

C
Clearance between package body and PCB.
H
Height of package from pin tip to top of package.
T
Thickness of pin.
L
Length of package body only.
LW
Pin width.
LL
Pin length from package to pin tip.
P
Pin pitch (distance between conductors to the PCB).
WB
Width of the package body only.
WL
Length from pin tip to pin tip on the opposite side.

Dual row
ImageFamilyPinNamePackageLWBWLHCPLLTLW
DIP Y Dual inline package 8-DIP9.2–9.86.2–6.487.627.72.54 (0.1 in)3.05–3.61.14–1.73
32-DIP15.242.54 (0.1 in)
LFCSPNLead-frame chip-scale package0.5
MSOP Y Mini small-outline package 8-MSOP334.91.10.100.650.950.180.17–0.27
10-MSOP334.91.10.100.50.950.180.17–0.27
16-MSOP4.0434.91.10.100.50.950.180.17–0.27
SO
SOIC
SOP		 Y Small-outline integrated circuit 8-SOIC4.8–5.03.95.8–6.21.720.10–0.251.271.050.19–0.250.39–0.46
14-SOIC8.55–8.753.95.8–6.21.720.10–0.251.271.050.19–0.250.39–0.46
16-SOIC9.9–103.95.8–6.21.720.10–0.251.271.050.19–0.250.39–0.46
16-SOIC10.1–10.57.510.00–10.652.650.10–0.301.271.40.23–0.320.38–0.40
SOTYSmall-outline transistorSOT-23-62.91.62.81.450.950.60.22–0.38
SSOPYShrink small-outline package0.65
TDFNNThin dual flat no-lead8-TDFN3330.7–0.80.65—0.19–0.3
TSOPYThin small-outline package0.5
TSSOP Package
TSSOP Package
TSSOPYThin shrink small-outline package8-TSSOP[26]2.9-3.14.3-4.56.41.20.150.650.09–0.20.19–0.3
Y 14-TSSOP[27] 4.9-5.1 4.3-4.5 6.4 1.1 0.05-0.15 0.65 0.09-0.2 0.19-0.30
20-TSSOP[28] 6.4-6.6 4.3-4.5 6.4 1.1 .05-0.15 0.65 0.09-0.2 0.19-0.30
µSOPYMicro small-outline package[29]µSOP-834.91.10.65
US8[30]YUS8 package22.33.1.70.5

Quad rows
ImageFamilyPinNamePackageWBWLHCLPLLTLW
PLCCNPlastic leaded chip-carrier1.27
CLCCNCeramic leadless chip-carrier48-CLCC14.2214.222.2114.221.016—0.508
LQFPYLow-profile quad flat package0.50
TQFPYThin quad flat-packageTQFP-4410.0012.000.35–0.500.801.000.09–0.200.30–0.45
TQFNNThin quad flat no-lead

LGA
Packagexyz
52-ULGA12 mm17 mm0.65 mm
52-ULGA14 mm18 mm0.10 mm
52-VELGA ? ? ?

Multi-chip packages

A variety of techniques for interconnecting several chips within a single package have been proposed and researched:

By terminal count
Example of component sizes, metric and imperial codes and comparison included
Composite image of a 11×44 LED matrix lapel name tag display using 1608/0603-type SMD LEDs. Top: A little over half of the 21×86 mm display. Center: Close-up of LEDs in ambient light. Bottom: LEDs in their own red light.
SMD capacitors (on the left) with two through-hole capacitors (on the right)
Main article: Chip carrier

Surface-mount components are usually smaller than their counterparts with leads, and are designed to be handled by machines rather than by humans. The electronics industry has standardized package shapes and sizes (the leading standardisation body is JEDEC).

The codes given in the chart below usually tell the length and width of the components in tenths of millimeters or hundredths of inches. For example, a metric 2520 component is 2.5 mm by 2.0 mm which corresponds roughly to 0.10 inches by 0.08 inches (hence, imperial size is 1008). Exceptions occur for imperial in the two smallest rectangular passive sizes. The metric codes still represent the dimensions in mm, even though the imperial size codes are no longer aligned. Problematically, some manufacturers are developing metric 0201 components with dimensions of 0.25 mm × 0.125 mm (0.0098 in × 0.0049 in),[32] but the imperial 01005 name is already being used for the 0.4 mm × 0.2 mm (0.0157 in × 0.0079 in) package. These increasingly small sizes, especially 0201 and 01005, can sometimes be a challenge from a manufacturability or reliability perspective.[33]

Rectangular passive components

Mostly resistors and capacitors.

Package Approximate dimensions, length × width Typical resistor
power rating (W)
MetricImperial
02010080040.25 mm × 0.125 mm0.010 in × 0.005 in
030150090050.3 mm × 0.15 mm0.012 in × 0.006 in0.02[34]
0402010050.4 mm × 0.2 mm0.016 in × 0.008 in0.031[35]
060302010.6 mm × 0.3 mm0.02 in × 0.01 in0.05[35]
100504021.0 mm × 0.5 mm0.04 in × 0.02 in0.062[36]–0.1[35]
160806031.6 mm × 0.8 mm0.06 in × 0.03 in0.1[35]
201208052.0 mm × 1.25 mm0.08 in × 0.05 in0.125[35]
252010082.5 mm × 2.0 mm0.10 in × 0.08 in
321612063.2 mm × 1.6 mm0.125 in × 0.06 in0.25[35]
322512103.2 mm × 2.5 mm0.125 in × 0.10 in0.5[35]
451618064.5 mm × 1.6 mm0.18 in × 0.06 in[37]
453218124.5 mm × 3.2 mm0.18 in × 0.125 in0.75[35]
456418254.5 mm × 6.4 mm0.18 in × 0.25 in0.75[35]
502520105.0 mm × 2.5 mm0.20 in × 0.10 in0.75[35]
633225126.3 mm × 3.2 mm0.25 in × 0.125 in1[35]
686327256.9 mm × 6.3 mm0.27 in × 0.25 in3
745129207.4 mm × 5.1 mm0.29 in × 0.20 in[38]

Tantalum capacitors
Main article: Tantalum capacitor
PackageDimensions (Length, typ. × width, typ. × height, max.)
EIA 2012-12 (KEMET R, AVX R)2.0 mm × 1.3 mm × 1.2 mm
EIA 3216-10 (KEMET I, AVX K)3.2 mm × 1.6 mm × 1.0 mm
EIA 3216-12 (KEMET S, AVX S)3.2 mm × 1.6 mm × 1.2 mm
EIA 3216-18 (KEMET A, AVX A)3.2 mm × 1.6 mm × 1.8 mm
EIA 3528-12 (KEMET T, AVX T)3.5 mm × 2.8 mm × 1.2 mm
EIA 3528-21 (KEMET B, AVX B)3.5 mm × 2.8 mm × 2.1 mm
EIA 6032-15 (KEMET U, AVX W)6.0 mm × 3.2 mm × 1.5 mm
EIA 6032-28 (KEMET C, AVX C)6.0 mm × 3.2 mm × 2.8 mm
EIA 7260-38 (KEMET E, AVX V)7.2 mm × 6.0 mm × 3.8 mm
EIA 7343-20 (KEMET V, AVX Y)7.3 mm × 4.3 mm × 2.0 mm
EIA 7343-31 (KEMET D, AVX D)7.3 mm × 4.3 mm × 3.1 mm
EIA 7343-43 (KEMET X, AVX E)7.3 mm × 4.3 mm × 4.3 mm

[39][40]

Aluminum capacitors
Main article: Electrolytic capacitor
PackageDimensions (Length, typ. × width, typ. × height, max.)
Cornell-Dubilier A3.3 mm × 3.3 mm × 5.5 mm
Chemi-Con D 4.3 mm × 4.3 mm × 5.7 mm
Panasonic B4.3 mm × 4.3 mm × 6.1 mm
Chemi-Con E 5.3 mm × 5.3 mm × 5.7 mm
Panasonic C5.3 mm × 5.3 mm × 6.1 mm
Chemi-Con F 6.6 mm × 6.6 mm × 5.7 mm
Panasonic D6.6 mm × 6.6 mm × 6.1 mm
Panasonic E/F, Chemi-Con H8.3 mm × 8.3 mm × 6.5 mm
Panasonic G, Chemi-Con J10.3 mm × 10.3 mm × 10.5 mm
Chemi-Con K13 mm × 13 mm × 14 mm
Panasonic H13.5 mm × 13.5 mm × 14 mm
Panasonic J, Chemi-Con L17 mm × 17 mm × 17 mm
Panasonic K, Chemi-Con M19 mm × 19 mm × 17 mm

[41][42][43]

Small-outline diode (SOD)
PackageDimensions (Length, typ. × width, typ. × height, max.)
SOD-80C3.5 mm × ⌀ 1.5 mm[44]
SOD-1232.65 mm × 1.6 mm × 1.35 mm[45]
SOD-1283.8 mm × 2.5 mm × 1.1 mm[46]
SOD-323 (SC-76)1.7 mm × 1.25 mm × 1.1 mm[47]
SOD-523 (SC-79)1.2 mm × 0.8 mm × 0.65 mm[48]
SOD-7231.0 mm × 0.6 mm × 0.65 mm[49]
SOD-9230.8 mm × 0.6 mm × 0.4 mm[50]

Metal electrode leadless face (MELF)
Main article: MELF Electronic Components

Mostly resistors and diodes; barrel shaped components, dimensions do not match those of rectangular references for identical codes.[51]

Package Dimensions
Typical resistor rating
Power (W)Voltage (V)
MicroMELF (MMU), 01022.2 mm × ⌀ 1.1 mm0.2–0.3150
MiniMELF (MMA), 02043.6 mm × ⌀ 1.4 mm0.25–0.4200
MELF (MMB), 02075.8 mm × ⌀ 2.2 mm0.4–1.0300

DO-214
Main article: DO-214

Commonly used for rectifier, Schottky, and other diodes.

PackageDimensions (incl. leads) (Length, typ. × width, typ. × height, max.)
DO-214AA (SMB)5.4 mm × 3.6 mm × 2.65 mm[52]
DO-214AB (SMC)7.95 mm × 5.9 mm × 2.25 mm[52]
DO-214AC (SMA)5.2 mm × 2.6 mm × 2.15 mm[52]

Small-outline transistor (SOT)
Main article: Small-outline transistor
Package AliasesDimensions (excl. leads) (Length, typ. × width, typ. × height, max.) Number of terminals Remark
SOT-23-3 TO-236-3, SC-592.92 mm × 1.3 mm × 1.12 mm[53] 3
SOT-89 TO-243,[54] SC-62[55]4.5 mm × 2.5 mm × 1.5 mm[56] 4 Center pin is connected to a large heat-transfer pad
SOT-143 TO-2532.9 mm × 1.3 mm × 1.22 mm[57] 4 Tapered body, one larger pad denotes terminal 1
SOT-223 TO-2616.5 mm × 3.5 mm × 1.8 mm[58] 4 One terminal is a large heat-transfer pad
SOT-323 SC-702 mm × 1.25 mm × 1.1 mm[59] 3
SOT-416 SC-751.6 mm × 0.8 mm × 0.9 mm[60] 3
SOT-663 1.6 mm × 1.2 mm × 0.6 mm[61] 3
SOT-723 1.2 mm × 0.8 mm × 0.55[62] 3 Has flat leads
SOT-883 SC-1011 mm × 0.6 mm × 0.5 mm[63] 3 Is lead-less

Other
  • DPAK (TO-252, SOT-428): Discrete Packaging. Developed by Motorola to house higher powered devices. Comes in three[64] or five-terminal[65] versions.
  • D2PAK (TO-263, SOT-404): Bigger than the DPAK; basically a surface mount equivalent of the TO220 through-hole package. Comes in 3, 5, 6, 7, 8 or 9-terminal versions.[66]
  • D3PAK (TO-268): Even larger than D2PAK.[67][68]

Small-outline transistor (SOT)
Package AliasesDimensions (excl. leads) (Length, typ. × width, typ. × height, max.) Number of terminals Leaded or leadless
SOT-23-6 SOT-26, SC-742.9 mm × 1.3 mm × 1.3 mm[69] 6 Leaded
SOT-353 SC-88A2 mm × 1.25 mm × 0.95 mm[70] 5 Leaded
SOT-363 SC-88, SC-70-62 mm × 1.25 mm × 0.95 mm[71] 6 Leaded
SOT-563 1.6 mm × 1.2 mm × 0.6 mm[72] 6 Leaded
SOT-665 1.6 mm × 1.6 mm × 0.55 mm[73] 5 Leaded
SOT-666 1.6 mm × 1.2 mm × 0.6 mm[74] 6 Leaded
SOT-886 1.45 mm × 1 mm × 0.5 mm[75] 6 Leadless
SOT-891 1 mm × 1 mm × 0.5 mm[76] 6 Leadless
SOT-953 1 mm × 0.8 mm × 0.5 mm[77] 5 Leaded
SOT-963 1 mm × 1 mm × 0.5 mm[78] 6 Leaded
SOT-1115 1 mm × 0.9 mm × 0.35 mm[79] 6 Leadless
SOT-1202 1 mm × 1 mm × 0.35 mm[80] 6 Leadless
Various SMD chips, desoldered
MLP package 28-pin chip, upside down to show contacts

Dual-in-line
Main article: Dual in-line package

Quad-in-line
Main article: Quad in-line package
  • Plastic leaded chip carrier (PLCC): square, J-lead, pin spacing 1.27 mm
  • Quad flat package (QFP): various sizes, with pins on all four sides
  • Low-profile quad flat-package (LQFP): 1.4 mm high, varying sized and pins on all four sides
  • Plastic quad flat-pack (PQFP), a square with pins on all four sides, 44 or more pins
  • Ceramic quad flat-pack (CQFP): similar to PQFP
  • Metric quad flat-pack (MQFP): a QFP package with metric pin distribution
  • Thin quad flat-pack (TQFP), a thinner version of LQFP
  • Quad flat no-lead (QFN): smaller footprint than leaded equivalent
  • Leadless chip carrier (LCC): contacts are recessed vertically to "wick-in" solder. Common in aviation electronics because of robustness to mechanical vibration.
  • Micro leadframe package (MLP, MLF): with a 0.5 mm contact pitch, no leads (same as QFN)
  • Power quad flat no-lead (PQFN): with exposed die-pads for heatsinking

Grid arrays
  • Ball grid array (BGA): A square or rectangular array of solder balls on one surface, ball spacing typically 1.27 mm (0.050 in)
    • Fine-pitch ball grid array (FBGA): A square or rectangular array of solder balls on one surface
    • Low-profile fine-pitch ball grid array (LFBGA): A square or rectangular array of solder balls on one surface, ball spacing typically 0.8 mm
    • Micro ball grid array (μBGA): Ball spacing less than 1 mm
    • Thin fine-pitch ball grid array (TFBGA): A square or rectangular array of solder balls on one surface, ball spacing typically 0.5 mm
  • Land grid array (LGA): An array of bare lands only. Similar to in appearance to QFN, but mating is by spring pins within a socket rather than solder.
  • Column grid array (CGA): A circuit package in which the input and output points are high-temperature solder cylinders or columns arranged in a grid pattern.
    • Ceramic column grid array (CCGA): A circuit package in which the input and output points are high-temperature solder cylinders or columns arranged in a grid pattern. The body of the component is ceramic.
  • Lead-less package (LLP): A package with metric pin distribution (0.5 mm pitch).

Non-packaged devices

Although surface-mount, these devices require specific process for assembly.

  • Chip-on-board (COB), a bare silicon chip, that is usually an integrated circuit, is supplied without a package (which is usually a lead frame overmolded with epoxy) and is attached, often with epoxy, directly to a circuit board. The chip is then wire bonded and protected from mechanical damage and contamination by an epoxy "glob-top".
  • Chip-on-flex (COF), a variation of COB, where a chip is mounted directly to a flex circuit. Tape-automated bonding process is also a chip-on-flex process as well.
  • Chip-on-glass (COG), a variation of COB, where a chip, typically a liquid crystal display (LCD) controller, is mounted directly on glass.
  • Chip-on-wire (COW), a variation of COB, where a chip, typically a LED or RFID chip, is mounted directly on wire, thus making it a very thin and flexible wire. Such wire may then be covered with cotton, glass or other materials to make into smart textiles or electronic textiles.

There are often subtle variations in package details from manufacturer to manufacturer, and even though standard designations are used, designers need to confirm dimensions when laying out printed circuit boards.

See also

References
  1. "CPU Collection Museum - Chip Package Information". The CPU Shack. Retrieved 2011-12-15.
  2. "Archived copy" (PDF). Archived from the original (PDF) on 2011-08-15. Retrieved 2011-02-03.{{cite web}}: CS1 maint: archived copy as title (link)
  3. "Integrated Circuit, IC Package Types; SOIC. Surface Mount Device Package". Interfacebus.com. Retrieved 2011-12-15.
  4. "National Semiconductor CERPACK Package Products". National.com. Archived from the original on 2012-02-18. Retrieved 2011-12-15.
  5. "National Semiconductor CQGP Package Products". National.com. Archived from the original on 2007-10-21. Retrieved 2011-12-15.
  6. "National's LLP Package". National.com. Archived from the original on 2011-02-13. Retrieved 2011-12-15.
  7. "LTCC Low Temperature Co-fired Ceramic". Minicaps.com. Retrieved 2011-12-15.
  8. Frye, R.C.; Gabara, T.J.; Tai, K.L.; Fischer, W.C.; Knauer, S.C. (1993). "Performance evaluation of MCM chip-to-chip interconnections using custom I/O buffer designs". Sixth Annual IEEE International ASIC Conference and Exhibit. Ieeexplore.ieee.org. pp. 464–467. doi:10.1109/ASIC.1993.410760. ISBN 978-0-7803-1375-0. S2CID 61288567.
  9. "National Semiconductor Launches New Generation of Ultra-Miniature, High Pin-Count Integrated Circuit Packages". National.com. Archived from the original on 2012-02-18. Retrieved 2011-12-15.
  10. Meyers, Michael; Jernigan, Scott (2004). Mike Meyers' A+ Guide to PC Hardware. The McGraw-Hill Companies. ISBN 978-0-07-223119-9.
  11. "Conexant Systems, Inc. - Conexant First to Launch DVB-S2 Demodulator and FEC Decoder". ir.conexant.com. Archived from the original on August 18, 2011.
  12. "Press Releases - Motorola Mobility, Inc". Motorola.com. Retrieved 2011-12-15.
  13. "Xilinx new CPLDs with two I/O banks". Eetasia.com. 2004-12-08. Retrieved 2011-12-15.
  14. "Packages". Chelseatech.com. 2010-11-15. Retrieved 2011-12-15.
  15. "Chip-Package SIDEBRAZE DIP". Archived from the original on 2008-11-20. Retrieved 2009-10-24.
  16. "Packaging Terminology". Texas Instruments.
  17. "CSP - Chip Scale Package". Siliconfareast.com. Retrieved 2011-12-15.
  18. "Understanding Flip-Chip and Chip-Scale Package Technologies and Their Applications - Maxim". Maxim-ic.com. 2007-04-18. Retrieved 2011-12-15.
  19. "Chip Scale Review Online". Chipscalereview.com. Retrieved 2011-12-15.
  20. https://www.nxp.com/docs/en/application-note/AN3846.pdf
  21. "Panasonic Industrial Devices".
  22. "Packaging Technology | National Semiconductor – Package Drawings, Part Marking, Package Codes, LLP, micro SMD, Micro-Array". National.com. Archived from the original on 2010-08-01. Retrieved 2011-12-15.
  23. "How Chip-On-Boards are Made - SparkFun Learn".
  24. "TO-226 Package". Archived from the original on 2010-08-23.
  25. "IR Packages".
  26. "TSSOP-8 Package Dimensions by Diodes Incorporated" (PDF).
  27. "F Package -- 14-Lead Plastic TSSOP (4.4mm)-- (Reference LTC DWG # 05-08-1650)" (PDF).
  28. "F Package -- 20-Lead Plastic TSSOP (4.4mm) -- (Reference LTC DWG # 05-08-1650)" (PDF).
  29. http://pdfserv.maximintegrated.com/package_dwgs/21-0036.PDF
  30. "Fairchild's TinyLogic family overview" (PDF). March 22, 2013. Archived from the original (PDF) on January 8, 2015.
  31. Proximity Communication - the Technology, 2004, archived from the original on 2009-07-18
  32. Murata, Tsuneo (2012-09-05). "Murata's world's Smallest Monolithic Ceramic Capacitor - 0201 <millimeter size> size (0.25 mm x 0.125 mm)" (Press release). Kyoto, Japan: Murata Manufacturing Co., Ltd. Archived from the original on 2015-12-28. Retrieved 2015-12-28.
  33. "White Paper 0201 and 01005 Adoption in Industry" (PDF). Retrieved 7 February 2018.
  34. "SMR Series Ultra-Compact Chip Resistors" (PDF). Datasheet. Rohm Semiconductor.
  35. "Thick Film Chip Resistors" (PDF). Datasheet. Panasonic. Archived from the original (PDF) on 2014-02-09.
  36. "Thick Film Chip Resistor - SMDC Series" (PDF). Datasheet. electronic sensor + resistor GmbH. Archived from the original (PDF) on 2015-12-28. Retrieved 2015-12-28.
  37. "SMD/BLOCK Type EMI Suppression Filters EMIFIL" (PDF). Catalog. Murata Manufacturing Co., Ltd. Archived from the original on 2015-12-28. Retrieved 2015-12-28.
  38. "POLYFUSE® Resettable Fuses SMD2920" (PDF). Datasheet. Littelfuse. Retrieved 2015-12-28.
  39. "TLJ Series - Tantalum Solid Electrolytic Chip Capacitors High CV Consumer Series" (PDF). Datasheet. AVX Corporation. Archived (PDF) from the original on 2015-12-28. Retrieved 2015-12-28.
  40. "Tantalum Surface Mount Capacitors - Standard Tantalum" (PDF). Catalog. KEMET Electronics Corporation. 2011-09-06. Archived from the original (PDF) on 2011-12-26. Retrieved 2015-12-28.
  41. "SMT Aluminum Electrolytic Capacitors" (PDF). Datasheet. Panasonic. Archived from the original (PDF) on 2012-03-01. Retrieved 2015-12-28.
  42. "Application Guide - Aluminum SMT Capacitors" (PDF). Resources. Cornell Dubilier. Archived (PDF) from the original on 2015-12-28. Retrieved 2015-12-28.
  43. "Surface Mount Aluminum Electrolytic Capacitors - Alchip-MVA Series" (PDF). Nippon Chemi-Con. Retrieved 2015-12-28.
  44. "SOD 80C Hermetically sealed glass surface-mounted package" (PDF). NXP Semiconductors. Archived (PDF) from the original on 2012-04-23. Retrieved 2015-12-28.
  45. "Designer's™ Data Sheet - Surface Mount Silicon Zener Diodes - Plastic SOD-123 Package" (PDF). Motorola. Retrieved 2015-12-28.
  46. "SOD128 plastic, surface mounted package" (PDF). NXP Semiconductors. 2017. Archived (PDF) from the original on 2015-12-28. Retrieved 2015-12-28.
  47. "SOD323 plastic, surface-mounted package" (PDF). NXP Semiconductors. 2019. Archived (PDF) from the original on 2012-11-19. Retrieved 2015-12-28.
  48. "SOD523 Package outline" (PDF). NXP Semiconductors. 2008. Archived (PDF) from the original on 2015-12-28. Retrieved 2015-12-28.
  49. "Comchip CDSP400-G" (PDF). Datasheet. Comchip Technology Corporation. Archived (PDF) from the original on 2015-12-28. Retrieved 2015-12-28.
  50. "SOD923 Microlead ultra small surface-mounted plastic package" (PDF). Datasheet. NXP Semiconductors.
  51. "Professional Thin Film MELF Resistors" (PDF). Vishay Intertechnology. 2014-04-22. Archived (PDF) from the original on 2015-12-28. Retrieved 2015-12-28.
  52. "Package Outline Dimensions - U-DFN1616-6 (Type F)" (PDF). Diodes Incorporated. Archived (PDF) from the original on 2015-12-28. Retrieved 2015-12-28.
  53. "Package Outline Drawing - P3.064" (PDF). Intersil. Archived (PDF) from the original on 2015-12-28. Retrieved 2015-12-28.
  54. "3-Lead Small Outline Transistor Package [SOT-89] (RK-3)" (PDF). Analog Devices. 2013-09-12. Archived (PDF) from the original on 2015-12-28. Retrieved 2015-12-28.
  55. "Standards for the Dimensions of Semiconductor Devices" (PDF). Electronic Industries Association of Japan. 1996-04-15. Archived (PDF) from the original on 2015-12-28. Retrieved 2015-12-28.
  56. "Package Information - SOT-89" (PDF). RICOH. Archived (PDF) from the original on 2015-12-28. Retrieved 2015-12-28.
  57. https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/sot-143ra/ra_4.pdf
  58. "SOT-233 Molded Package" (PDF). Fairchild Semiconductor. 2008-02-26. Archived (PDF) from the original on 2015-12-28. Retrieved 2015-12-28.
  59. "SOT323 Package outline" (PDF). NXP Semiconductors. 2008. Archived from the original (PDF) on 2015-12-28. Retrieved 2015-12-28.
  60. "SOT416 Package outline" (PDF). NXP Semiconductors. 2010. Archived from the original (PDF) on 2015-12-28. Retrieved 2015-12-28.
  61. "SOT663 Package outline" (PDF). NXP Semiconductors. 2008. Archived (PDF) from the original on 2015-12-28. Retrieved 2015-12-28.
  62. "Mechanical Case Outline SOT-723" (PDF). ON Semiconductor. 2009-08-10. Retrieved 2015-12-28.
  63. "SOT883 Package outline" (PDF). NXP Semiconductors. 2008. Archived (PDF) from the original on 2015-12-28. Retrieved 2015-12-28.
  64. "D-PAK (TO-252AA) Outline Dimensions" (PDF). Vishay Intertechnology. 2012-12-05. Archived from the original (PDF) on 2015-12-28. Retrieved 2015-12-28.
  65. "Mechanical Case Outline - DPAK-5" (PDF). ON Semiconductor. 2014-05-15. Retrieved 2015-12-28.
  66. "D2PAK Outline Dimensions" (PDF). Vishay Intertechnology. 2015-07-08. Archived from the original (PDF) on 2015-12-28. Retrieved 2015-12-28.
  67. "Phase-leg Rectifier Diode" (PDF). IXYS Corporation. 2002. Archived (PDF) from the original on 2015-12-28. Retrieved 2015-12-28.
  68. admin. "D3PAK: Decawatt Package 3 (TO-268, Discrete Package) | MADPCB". Printed Circuit Board Manufacturing, PCB Assembly & PCB Design - MADPCB. Retrieved 2022-04-08.
  69. "P6.064 Package Outline Drawing" (PDF). Intersil. 2010. Archived (PDF) from the original on 2015-12-28. Retrieved 2015-12-28.
  70. "SOT353 Package outline" (PDF). NXP Semiconductors. 2008. Archived from the original (PDF) on 2015-12-28. Retrieved 2015-12-28.
  71. "SOT363 Package outline" (PDF). NXP Semiconductors. 2008. Archived from the original (PDF) on 2015-12-28. Retrieved 2015-12-28.
  72. "SOT563 Package Details" (PDF). Central Semiconductor. 2015-05-22. Archived (PDF) from the original on 2015-12-28. Retrieved 2015-12-28.
  73. "SOT665 Package outline" (PDF). NXP Semiconductors. 2008. Archived from the original (PDF) on 2015-12-28. Retrieved 2015-12-28.
  74. "SOT666 Package outline" (PDF). NXP Semiconductors. 2008. Archived from the original (PDF) on 2015-12-28. Retrieved 2015-12-28.
  75. "SOT886 Package outline" (PDF). NXP Semiconductors. 2017.
  76. "SOT891 XSON6: plastic extremely thin small outline package; noleads" (PDF). NXP Semiconductors. 2016.
  77. "SOT953 Package information" (PDF). Diodes Incorporated. 2017.
  78. "SOT963 Package details" (PDF). Central Semiconductor Corp. 2010.
  79. "SOT1115 Package outline" (PDF). NXP Semiconductors. 2010. Archived from the original (PDF) on 2015-12-28. Retrieved 2015-12-28.
  80. "SOT1202 Package outline" (PDF). NXP Semiconductors. 2010. Archived from the original (PDF) on 2015-12-28. Retrieved 2015-12-28.
  81. "IC Package Types". www.SiliconFarEast.com. Archived from the original on 2013-07-26. Retrieved 2015-12-28.
Wikimedia Commons has media related to IC packages.
This article is issued from Wikipedia. The text is licensed under Creative Commons - Attribution - Sharealike. Additional terms may apply for the media files.