SÜSS MicroTec

In 1949, Karl Süss founded Karl Süss KG and, as a sales representative for Bavaria, took over the distribution of optical instruments (microscopes, cameras, and laboratory equipment) from Ernst Leitz GmbH. With increasing technical expertise, the company changed from a pure sales company with five employees to a contract manufacturer.[3]

The order from Siemens in 1963 to develop a simple photolithography device laid the foundation for the company’s later direction and was its first step into the semiconductor industry. The first order from Siemens involved small measuring tables with stereo microscopes bonded together. In 1963, the company developed the prototype of the first mask aligner, MJB3, for Siemens.

In 1968, the company moved its production and now 30 employees to Garching.[3]

With the development of the semiconductor industry, Suss Microtec started to manufacture diamond scribers and spin coaters. The first mask aligner, which enabled double-sided exposure, was invented in 1974. Suss MicroTec, whose name already stood for photolithography in the research and development sector, now also focused on customers from the manufacturing industry. In 1975, the first mask aligner for mass production was developed, the MJB55.[3]

In the 1980s, overseas activities began with a plant in Waterbury, Vermont, USA. In 1983, an Asian subsidiary was established in Thailand, followed by sales offices in Japan, China, and Taiwan. Suss Microtec was preparing to manufacture bonders. In addition, the company made a foray into the very specialized field of X-ray stepper lithography. A plant for the production of probers was opened in Dresden.

In addition to aligners, systems were developed for related processes such as development, cleaning, and bonding. The company went into volume production with the wafer bonder in 1980 in the U.S. in Waterbury/Vermont.[3]

Suss Microtec developed the first substrate bonder in 1989. In microsystems technology, substrate bonders allowed heterogeneous materials to be bonded with structured surfaces. In 1993, the company added device bonders to its product line.

In 1994, the company founder Karl Süss and his eldest son Ekkehard Süss died shortly after each other. This led to a reorganization of the company. Winfried Süss, son of Karl Süss, represented the family on the supervisory board. In 1999, the holding company of the Suss Group went public as Suss Microtec AG.[3]

Through the acquisition of Fairchild Technologies, the company entered the upper market segments with coating systems in 2000. From 2002, the micro-optics business of the newly founded Suss Microoptics strengthened Suss Microtec’s lithographic portfolio.[4] In 2002, the subsidiaries were renamed Suss Microtec.

In 2006, the successfully used equipment division was spun off into Suss Microtec Reman. In 2007, the Device Bonder product line was sold,[5] and two years later the Prober line.[6] This was followed by the opening of offices in Singapore and Korea.[3]

The 2010s were characterized by fluctuations in the semiconductor equipment technology market. As a result, the company changed its business policy and initiated a focus on core competencies and targeted acquisitions. In 2010, Suss Microtec acquired Hamatech APE, an equipment manufacturer for photomask processing technology. In the same year, the production of substrate bonders was relocated from Waterbury (USA) to the newly acquired plant in Sternenfels. Since then, coating equipment, bonders, and photomask processing equipment have been manufactured at the same plant, which has thus become a center of excellence for wet processing technology. With the acquisition of Tamarack Scientific in 2012, the company added advanced laser processing technology for microstructure transfer to its lithographic portfolio.[3]

Due to increasing digitalization in all areas of life, Suss Microtec expanded its production capacities in 2020 with a new production facility in Taiwan.[7] In addition, another technology was added in the same year when the company acquired the inkjet printing business of solar specialist Meyer Burger, PiXDRO.[8]

Sales subsidiaries of Suss Microtec exist in Thailand, Japan, Taiwan, China, and Korea, among others.

Since the foundation of the company GMA in 1989, which emerged from the former Elektromat, in Sacka near Dresden, Suss Microtec has been producing its own systems for testing micro components. In 1993, Suss Microtec expanded its product range with the acquisition of the French S.E.T. to include spin coaters and device bonders. The next acquisition was in 1999 with Convac (sold by Fairchild Semiconductor). Through the acquisition of Image Technology, USA, photomasks used for lithographic processes have supplemented the Group’s portfolio since 2001. Since the foundation of Suss Microoptics in Neuchâtel, Switzerland in 2002, the company also offers optical microlenses.

In 2007, Suss Microtec sold its device bonder product division. With the acquisition of Hamatech APE[9] at the beginning of 2010 and the sale of the Test Systems division,[6] the Suss Group further expanded its core competence in wet processes on the one hand and set a clear focus on the microstructuring of components on the other.

In order to consolidate the portfolio, 2011 saw the sale of SUSS MicroTec Precision Photomask Inc.

In 2012, Suss Microtec purchased Tamarack Scientific Co. Inc.[10] Tamarack develops, produces, and distributes UV projection exposure equipment and laser-based microstructuring systems.

The company’s founder already maintained a close exchange with science. Suss Microtec is continuously expanding its efforts in the area of research and development in order to increase the speed of innovation. In addition to lively development activities and intensive cooperation with leading research institutes and universities, all processes are geared to the highest possible development speed and efficiency in order to improve the added value for users.

Suss Microtec cooperates with various research organizations worldwide.[11]

Important end applications for sensors and microelectromechanical systems (MEMS) are consumer electronics (consumer electronics, household appliances, cell phones, cameras, etc.), mechanical and plant engineering, control, measurement and regulation technology, processors, laboratory technology, medical technology, automotive, aerospace and security applications.