delid

de- +‎ lid

delid (third-person singular simple present delids, present participle delidding, simple past and past participle delidded)

1. To remove a hermetically sealed lid from
   1. (microelectronics) To remove the lid from a microchip.
      • 1973, International Microelectronics conference, Proceedings of the technical program, page 155:

        However, if time is of the essence, the analyst oftentimes delids the package and runs a voltage contrast map in the SEM.

      • 1984, William S. Burroughs, Esquire: The Magazine for Men - Volume 102, page 78:

        It was time to delid a Fujitsu chip.

      • 2004, Microelectronics Failure Analysis: Desk Reference, →ISBN, page 2004:

        Our chemical delidding experiments were carried out with flip chip packages having aluminum and AlSiC lids and organic substrates, with die sizes from 6.6mm to 17mm and package body sizes from 23mm to 45mm.

   2. To remove the lid from a can.
      • 1983, Processed Prepared Food - Volume 152, page 87:

        Vise-like clamping action of lid remover jaws assures reliable lid removal every time. Model 825 Can Opening System washes cans, opens cans, delids cans and dumps product automatically at a rate of 40 cans per minute with one operator.

      • 1984, Food Production/management - Volume 107, page 33:

        The solid food system automatically opens cans, delids cans, and dumps the product aided by various dumping assists; vibrator, bottom punch, water jets, and needle punch with airblow.

      • 1990, Hotels: The Magazine of the Worldwide Hotel Industry, page 69:

        A can opening system automatically washes, opens, delids and dumps contents of up to 30 #10 cans per minute.

delid (plural delids)

1. The process of delidding.
   • 1972, International Society for Hybrid Microelectronics, 1972 International Microelectronic Symposium:

     Excessive leakage currents were measured for four chips (2 NPN, 1 PNP, and 1 diode) after the delid operation.

   • 1994, Proceedings of the International Conference on Multichip Modules:

     After chip attach, wire bonding, and preliminary testing, this configuration is then hermetically sealed by routine seam welding of a Kovar lid onto the seal ring. The seal ring and lid were designed to permit two delid and rework cycles if necessary.

   • 2004, Microelectronics Failure Analysis: Desk Reference, →ISBN:

     For the chemical delid process, note that the devices and the solvents should come to temperature simultaneously, as adding a room-temperature package to a hot solvent can cause die cracking in large packages (effectively acts as a thermal shock).

• idled