Intel Mobile Communications

Intel Mobile Communications (IMC), is the mobile research and development division of Intel. It was formed when Intel completed the acquisition of the Wireless Solutions (WLS) division of Infineon early in 2011 for US$1.4 billion.[1] The Infineon subsidiary Comneon was also acquired by Intel and integrated into Intel Mobile Communications.[2][3] IMC maintained offices in Munich from the Comneon deal under Intel Mobile Communications GmbH.[4][5]

Intel Mobile Communications
TypeWholly owned subsidiary
Founded2011
FateSmartphone communications division Acquired by Apple
ProductsSemiconductor products and solutions for wireless communications
ParentIntel Corporation

IMC develops, manufactures and markets semiconductor products and solutions for wireless communications. It targets the fast-growing market segments of smart phones, connected devices (e.g. tablets, USB dongles, mobile PCs, M2M), and ultra-low-cost/entry phones. Its roadmap is focused on providing cost-effective 2G/3G single-chip platforms for ULC phones up to entry-level smart phones and 3G/4G slim modem and RF solutions for mid-to high-end smart phones and connected devices.

In 2013 due to re-organization, a new organization was formed, named WPRD (Wireless Products Research & Development), which included the former IMC teams, and also the former MWG (Intel legacy Mobile and Wireless Group). This organization was managed by Aicha Evans. In 2016 the name was changed to iCDG (Intel Communications Devices Group). In 2017 Aicha Evans moved and became the chief strategy officer of Intel.

Products

Intel Mobile Communications developed 2G, 3G, 4G and 5G modems under the Intel XMM modems brand.[6]

Intel Mobile Communications developed the Intel Atom Z2000, Z2460, Z2580 system on a chip (SoC) processors.[7]

In 2017, external publications (not confirmed by Intel or Apple) indicated that the Apple iPhone 7 & 8 LTE modems, in most of the units shipped, were based on Intel chips (developed at IMC or iCDG).[8] [9]

Acquisition by Apple

On April 16, 2019, Apple and Qualcomm reached a settlement which included Apple paying an unspecified amount, entering into a six-year patent licensing agreement, and a multi-year agreement for Qualcomm to provide hardware to Apple.[10] Shortly after Intel announced they will exit the 5G smartphone modem business to focus 5G efforts on network infrastructure.[11]

On July 25, 2019, Apple and Intel announced an agreement for Apple to acquire Intel Mobile Communications' smartphone modem business for US$1 billion.[12] Intel will continue to develop modems for non-smartphones such as PCs, IoT devices, and autonomous vehicles.

References
  1. AG, Infineon Technologies. "Intel to Acquire Infineon's Wireless Solutions Business - Infineon Technologies". www.infineon.com. Retrieved 2019-07-26.
  2. "Intel® Mobile Communications Mobile Software". Intel. Retrieved 2013-10-02.
  3. "Unternehmensinformationen: Intel Mobile Communications" (in German). Intel. Archived from the original on 2013-10-04. Retrieved 2013-10-02.
  4. "Intel Acquires Intel Mobile Communications". Mergr.com. Jan 31, 2011.
  5. "scan.c Linux Kernel". Bootlin: Linux Kernel.
  6. "Intel Mobile Modem Solutions". Intel. Retrieved 2019-05-11.
  7. Wong Chung Wee (2013-04-10). "Intel Reiterates its Mobile Processor Offerings at Annual Developers Forum". HardwareZone Singapore. Retrieved 2013-06-13.
  8. "Apple confirmed limiting iPhone 7 Qualcomm modem to keep performance on par with Intel chip". appleinsider. Retrieved 2016-11-18.
  9. "2018 iPhones might use Intel modems exclusively, pushing Qualcomm aside". TheVerge. Retrieved 2018-02-05.
  10. Kastrenakes, Jacob (2019-04-16). "Apple and Qualcomm drop all lawsuits in surprise settlement". The Verge. Retrieved 2019-05-11.
  11. "Intel to Exit 5G Smartphone Modem Business, Focus 5G Efforts on Network Infrastructure and Other Data-Centric Opportunities". Intel Newsroom. Retrieved 2019-05-11.
  12. "Apple to acquire the majority of Intel's smartphone modem business". Apple Newsroom. Retrieved 2019-07-26.
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