Zen 3

Zen 3 is the codename for a CPU microarchitecture by AMD, released on November 5, 2020.[1][2] It is the successor to Zen 2 and uses TSMC's 7 nm process for the chiplets and GlobalFoundries's 14 nm process for the I/O die on the server chips and 12 nm for desktop chips.[3] Zen 3 powers Ryzen 5000 mainstream desktop processors (codenamed "Vermeer") and Epyc server processors (codenamed "Milan").[4][5] Zen 3 is supported on motherboards with 500 series chipsets; 400 series boards also saw support on select B450 / X470 motherboards with certain BIOSes.[6] Zen 3 is the last microarchitecture before AMD switched to DDR5 memory and new sockets, which are AM5 for the desktop "Ryzen" chips alongside SP5 and SP6 for the EPYC server platform.[2] According to AMD, Zen 3 has a 19% higher instructions per cycle (IPC) on average than Zen 2.

AMD Zen 3
General information
LaunchedNovember 5, 2020 (November 5, 2020)
Designed byAMD
Common manufacturer(s)
Cache
L1 cache64 KB (per core)
L2 cache512 KB (per core)
L3 cache
  • 32 MB (per CCX)
  • 64 MB (per 3D V-Cache CCD)
  • 16 MB (in APUs)
Architecture and classification
Technology node
Instruction setAMD64 (x86_64)
Physical specifications
Cores
    • Desktop: 4 to 16
    • Workstation: 16 to 64
    • Server: 16 to 64
Package(s)
  • Package FP6
Socket(s)
Products, models, variants
Product code name(s)
  • Desktop
    • Vermeer (w/o iGPU)
    • Cézanne (APU)
    • Chagall

  • Thin & Light Mobile
    • Cézanne
    • Barcelo
    • Barcelo-R

  • High-End Mobile
    Cézanne
  • Server
    • Milan
    • Milan-X

History
Predecessor(s)Zen 2
Successor(s)
Support status
Supported

On April 1, 2022, AMD released the new Ryzen 6000 series for the laptop, using an improved Zen 3+ architecture.[7] On April 20, 2022, AMD also released the Ryzen 7 5800X3D desktop processor, which increases the single threading performance by another 15% in gaming by using, for the first time in a PC product, 3D vertically stacked L3 cache.[8]

Features

Zen 3 is a significant incremental improvement over its predecessors, with an IPC increase of 19%,[9] and being capable of reaching higher clock speeds.

Like Zen 2, Zen 3 is composed of up to 2 core complex dies (CCD) along with a separate IO die containing the I/O components. A Zen 3 CCD is composed of a single core complex (CCX) containing 8 CPU cores and 32 MB of shared L3 cache, this is in contrast to Zen 2 where each CCD is composed of 2 CCX, each containing 4 cores each as well as 16 MB of L3 cache. The new configuration allows all 8 cores of the CCX to directly communicate with each other and the L3 Cache instead of having to use the IO die through the Infinity Fabric.[9]

Zen 3 (along with AMD's RDNA2 GPUs) were also the first implementation of Resizable BAR, an optional feature introduced in PCIe 2.0, that was branded as Smart Access Memory (SAM). This technology allows CPU to directly access all of compatible video card's VRAM.[10] Intel and Nvidia have since implemented this feature as well.[11]

  • A de-lidded Ryzen 5 5600X. Only one CCD is present. The contacts for a second CCD are visible.
    A de-lidded Ryzen 5 5600X. Only one CCD is present. The contacts for a second CCD are visible.
  • Close-up of the CCD, taken under infrared lighting. This die was damaged by the de-lidding process.
    Close-up of the CCD, taken under infrared lighting. This die was damaged by the de-lidding process.
  • Close-up of the I/O die
    Close-up of the I/O die

In Zen 3, a single 32MB L3 cache pool is shared among all 8 cores in a chiplet, vs. Zen 2's two 16MB pools each shared among 4 cores in a core complex, of which there were two per chiplet. This new arrangement improves the cache hit rate as well as performance in situations that require cache data to be exchanged among cores, but increases cache latency from 39 cycles in Zen 2 to 46 clock cycles and halves per-core cache bandwidth, although both problems are partially mitigated by higher clock speeds. Total cache bandwidth on all 8 cores combined remains the same due to power consumption concerns. L2 cache capacity and latency remain the same at 512KB and 12 cycles. All cache read and write operations are done at 32 bytes per cycle.[12]

On April 20, 2022, AMD released the R7 5800X3D, the second to last member of the AM4 family. It features, for the first time in a desktop PC product, 3D-stacked vertical L3 cache, which in the size of an extra 64 MB on top of the usual 32 MB increases the total amount to 96 MB and brings tremendous performance improvements for gaming, rivalling the newest processors of the competition while being much more power efficient.[8] The last member of the AM4 family was the 5600X3D, released July 7, 2023.

Improvements
CCD layouts comparison for Zen 2 and Zen 3

Zen 3 has made the following improvements over Zen 2:[12][13]

  • An increase of 19% in instructions per clock
  • The base core chiplet has a single eight-core complex (versus two four-core complexes in Zen 2)
  • A unified 32MB L3 cache pool equally available to all 8 cores in a chiplet, vs Zen 2's two 16MB pools each shared among 4 cores in a core complex.
    • On mobile: A unified 16MB L3
  • A unified 8-core CCX (from 2x 4-core CCX per CCD)
  • Increased branch prediction bandwidth. L1 branch target buffer size increased to 1024 entries (vs 512 in Zen 2)
  • New instructions
  • Improved integer units
    • 96 entry integer scheduler (up from 92)
    • 192 entry physical register file (up from 180)
    • 10 issue per cycle (up from 7)
    • 256 entry reorder-buffer (up from 224)
    • fewer cycles for DIV/IDIV ops (10...20 from 16...46)
  • Improved floating point units
    • 6 µOP dispatch width (up from 4)
    • FMA latency reduced by 1 cycle (down from 5 to 4)
  • Additional 64MB 3D vertically stacked dense library L3 cache (in Ryzen 7 5800X3D)

Feature tables

CPUs

APUs

APU features table

Products
AMD Ryzen 7 5800X

On October 8, 2020, AMD announced four Zen 3-based desktop Ryzen processors, consisting of one Ryzen 5, one Ryzen 7, and two Ryzen 9 CPUs and featuring between 6 and 16 cores.[1]

Desktop CPUs

The Ryzen 5000 series desktop CPUs are codenamed Vermeer. Some CPU models are based on Cezanne APUs with the integrated GPU disabled. Meanwhile the Ryzen Threadripper Pro 5000 series were codenamed Chagall.

Common features of Ryzen 5000 desktop CPUs:

  • Socket: AM4.
  • All the CPUs support DDR4-3200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 24 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • Fabrication process: TSMC 7FF.
Branding and model Cores
(threads)		 Thermal solution Clock rate (GHz) L3 cache
(total)		 TDP Chiplets Core
config[lower-roman 1]		 Release
date		 MSRP
Base Boost
Ryzen 9 5950X 16 (32) N/A 3.4 4.9 64 MB 105 W 2 × CCD
1 × I/OD		 2 × 8 Nov 5, 2020 US $799
5900X 12 (24) 3.7 4.8 2 × 6 US $549
5900 3.0 4.7 65 W Jan 12, 2021 OEM
PRO 5945 Sep 2022[14]
Ryzen 7 5800X3D 8 (16) 3.4 4.5 96 MB 105 W 1 × CCD
1 × I/OD		 1 × 8 Apr 20, 2022 US $449
5800X 3.8 4.7 32 MB Nov 5, 2020
5800 3.4 4.6 65 W Jan 12, 2021 OEM
5700X Apr 4, 2022 US $299
PRO 5845 Sep 2022 OEM
Ryzen 5 5600X3D 6 (12) 3.3 4.4 96 MB 105 W 1 × 6 Jul 7, 2023
US Only[15]		 US $229
5600X Wraith Stealth 3.7 4.6 32 MB 65 W Nov 5, 2020 US $299
5600 3.5 4.4 Apr 4, 2022 US $199
PRO 5645 N/A 3.7 4.6 Sep 2022 OEM
  1. Core Complexes (CCX) × cores per CCX

Common features of Ryzen 5000 (Cezanne) desktop CPUs:

  • Socket: AM4.
  • CPUs support DDR4-3200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • Fabrication process: TSMC 7FF.
Branding and Model Cores
(threads)		 Thermal Solution Clock rate (GHz) L3 cache
(total)		 TDP Core
config[lower-roman 1]		 Release
date		 MSRP
Base Boost
Ryzen 7 5700[16][17] 8 (16) N/A 3.7 4.6 16 MB 65 W 1 × 8 Unknown OEM
Ryzen 5 5500 6 (12) Wraith Stealth 3.6 4.2 1 × 6 Apr 4, 2022 US $159
Ryzen 3 5100[18] 4 (8) N/A 3.8 8 MB 1 × 4 Unknown OEM
  1. Core Complexes (CCX) × cores per CCX

Common features of Ryzen 5000 workstation CPUs:

  • Socket: sWRX8.
  • All the CPUs support DDR4-3200 in octa-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 128 PCIe 4.0 lanes. 8 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • Fabrication process: TSMC 7FF.
Branding and Model Cores
(threads)		 Clock rate (GHz) L3 cache
(total)		 TDP Chiplets Core
config[lower-roman 1]		 Release
date		 MSRP
Base Boost
Ryzen
Threadripper
PRO		 5995WX 64 (128) 2.7 4.5 256 MB 280 W 8 × CCD
1 × I/OD		 8 × 8 Mar 8, 2022
(OEM) /
?
(retail)		 OEM /
US $6500
5975WX 32 (64) 3.6 128 MB 4 × CCD
1 × I/OD		 4 × 8 Mar 8, 2022
(OEM) /
?
(retail)		 OEM /
US $3300
5965WX 24 (48) 3.8 4 × 6 Mar 8, 2022
(OEM) /
?
(retail)		 OEM /
US $2400
5955WX 16 (32) 4.0 64 MB 2 × CCD
1 × I/OD		 2 × 8 Mar 8, 2022 OEM
5945WX 12 (24) 4.1 2 × 6
  1. Core Complexes (CCX) × cores per CCX

Cezanne

Common features of Ryzen 5000 desktop APUs:

  • Socket: AM4.
  • All the CPUs support DDR4-3200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • Includes integrated GCN 5th generation GPU.
  • Fabrication process: TSMC 7FF.
Branding and Model CPU GPU Thermal Solution TDP Release
date		 MSRP
Cores
(threads)		 Clock rate (GHz) L3 cache
(total)		 Core
config[lower-roman 1]		 Model Clock
(GHz)		 Config[lower-roman 2] Processing
power[lower-roman 3]
(GFLOPS)
Base Boost
Ryzen 7 5700G[lower-alpha 1] 8 (16) 3.8 4.6 16 MB 1 × 8 Radeon
Graphics
[lower-alpha 2]		 2.0 512:32:8
8 CU		 2048 Wraith Stealth 65 W Apr 13, 2021
(OEM) /
Aug 5, 2021
(retail)		 OEM /
US $359
5700GE[lower-alpha 1] 3.2 OEM 35 W Apr 13, 2021 OEM
Ryzen 5 5600G[lower-alpha 1] 6 (12) 3.9 4.4 1 × 6 1.9 448:28:8
7 CU		 1702.4 Wraith Stealth 65 W Apr 13, 2021
(OEM) /
Aug 5, 2021
(retail)		 OEM /
US $259
5600GE[lower-alpha 1] 3.4 OEM 35 W Apr 13, 2021 OEM
Ryzen 3 5300G[lower-alpha 1] 4 (8) 4.0 4.2 8 MB 1 × 4 1.7 384:24:8
6 CU		 1305.6 65 W
5300GE[lower-alpha 1] 3.6 35 W
  1. Core Complexes (CCX) × cores per CCX
  2. Unified shaders : texture mapping units : render output units and compute units (CU)
  3. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. Model also available as PRO version as 5350GE,[lower-alpha 3] 5350G,[lower-alpha 4] 5650GE,[lower-alpha 5] 5650G,[lower-alpha 6] 5750GE,[lower-alpha 7] 5750G,[lower-alpha 8] released June 1, 2021.[lower-alpha 9]
  2. All of the iGPUs are branded as AMD Radeon Graphics.
  3. "AMD Ryzen 3 PRO 5350GE". AMD.
  4. "AMD Ryzen 3 PRO 5350G". AMD.
  5. "AMD Ryzen 5 PRO 5650GE". AMD.
  6. "AMD Ryzen 5 PRO 5650G". AMD.
  7. "AMD Ryzen 7 PRO 5750GE". AMD.
  8. "AMD Ryzen 7 PRO 5750G". AMD.
  9. btarunr (June 1, 2021). "AMD Announces Ryzen 5000G and PRO 5000G Desktop Processors". TechPowerUp.

Cezanne
Branding and Model CPU GPU TDP Release
date
Cores
(Threads)		 Clock rate (GHz) L3 cache
(total)		 Core
config[lower-roman 1]		 Model Clock
(GHz)		 Config[lower-roman 2] Processing
power
(GFLOPS)[lower-roman 3]
Base Boost
Ryzen 9 5980HX[19] 8 (16) 3.3 4.8 16 MB 1 × 8 Radeon
Graphics
[lower-alpha 1]		 2.1 512:32:8
8 CUs		 2150.4 35–54 W Jan 12, 2021
5980HS[20] 3.0 35 W
5900HX[21] 3.3 4.6 35–54 W
5900HS[22] 3.0 35 W
Ryzen 7 5800H[23][24] 3.2 4.4 2.0 2048 35–54 W
5800HS[25] 2.8 35 W
5800U[note 1][26] 1.9 10–25 W
Ryzen 5 5600H[27][28] 6 (12) 3.3 4.2 1 × 6 1.8 448:28:8
7 CUs		 1612.8 35–54 W
5600HS[29] 3.0 35 W
5600U[note 1][30] 2.3 10–25 W
5560U[31] 4.0 8 MB 1.6 384:24:8
6 CUs		 1228.8
Ryzen 3 5400U[note 1][32][33] 4 (8) 2.7 4.1 1 × 4
  1. All of the iGPUs are branded as AMD Radeon Graphics.
  1. Core Complexes (CCX) × cores per CCX
  2. Unified shaders : texture mapping units : render output units and compute units (CU)
  3. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. Model also available as PRO version as 5450U,[34] 5650U,[35] 5850U,[36] released on March 16, 2021 and as 5475U,[37] 5675U,[38] 5875U,[39] released on April 19, 2022.
  2. Model also available as Chromebook optimized version as 5425C,[40] 5625C,[41] 5825C,[42] released on May 5, 2022.

Barceló
Branding and Model CPU GPU TDP Release
date
Cores
(Threads)		 Clock rate (GHz) L3 cache
(total)		 Core
config[lower-roman 1]		 Model Clock
(GHz)		 Config[lower-roman 2] Processing
power
(GFLOPS)[lower-roman 3]
Base Boost
Ryzen 7 5825U[note 1][note 2][43] 8 (16) 2.0 4.5 16 MB 1 × 8 Radeon
Graphics
[lower-alpha 1]		 2.0 512:32:8
8 CUs		 2048 15 W Jan 4, 2022
Ryzen 5 5625U[note 1][note 2][44] 6 (12) 2.3 4.3 1 × 6 1.8 448:28:8
7 CUs		 1612.8
Ryzen 3 5125C[45] 2 (4) 3.0 — 8 MB 1 × 2  ? 192:12:8
3 CU		  ? May 5, 2022
  1. All of the iGPUs are branded as AMD Radeon Graphics.
  1. Core Complexes (CCX) × cores per CCX
  2. Unified shaders : texture mapping units : render output units and compute units (CU)
  3. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. Model also available as PRO version as 5450U,[46] 5650U,[47] 5850U,[48] released on March 16, 2021 and as 5475U,[49] 5675U,[50] 5875U,[51] released on April 19, 2022.
  2. Model also available as Chromebook optimized version as 5425C,[52] 5625C,[53] 5825C,[54] released on May 5, 2022.

Barceló-R

Common features of Ryzen 7030 notebook APUs:

Branding and Model CPU GPU TDP Release
date
Cores
(Threads)		 Clock rate (GHz) L3 cache
(total)		 Core
config[lower-alpha 1]		 Model Clock
(GHz)
Base Boost
Ryzen 7 (PRO) 7730U 8 (16) 2.0 4.5 16 MB 1 × 8 Vega
8 CU		 2.0 15 W Jan 4, 2023
[55]
Ryzen 5 (PRO) 7530U 6 (12) 1 × 6 Vega
7 CU
Ryzen 3 (PRO) 7330U 4 (8) 2.3 4.3 8 MB 1 × 4 Vega
6 CU		 1.8
  1. Core Complexes (CCX) × cores per CCX

Embedded CPUs
Model Release
date		 Fab CPU Socket PCIe
support		 Memory
support		 TDP
Cores
(threads)		 Clock rate (GHz) Cache
Base Boost L1 L2 L3
V3C14[56][57] September 27, 2022[58] TSMC
7FF		 4 (8) 2.3 3.8 32 KB inst.
32 KB data
per core		 512 KB
per core		 8 MB FP7r2 20
(8+4+4+4)
PCIe 4.0		 DDR5-4800
dual-channel		 15 W
V3C44[56][57] 3.5 3.8 45 W
V3C16[56][57] 6 (12) 2.0 3.8 16 MB 15 W
V3C18I[56][57] 8 (16) 1.9 3.8 15 W
V3C48[56][57] 3.3 3.8 45 W

    Server CPUs

    The Epyc server line of chips based on Zen 3 is named Milan and is the final generation of chips using the SP3 socket.[5] Epyc Milan was released on March 15, 2021.[59]

    Model Price
    (USD)    		 Fab Chiplets Cores
    (threads)    		 Core
    config[lower-roman 1]    		 Clock rate (GHz) Cache Socket
    &
    Scaling    		 TDP
    Base Boost L1 L2 L3
    EPYC 7773X $8800 TSMC
    7FF    		 8 × CCD
    1 × I/OD    		 64 (128) 8 × 8 2.20 3.50 32 KB inst.
    32 KB data
    (per core)    		 512 KB
    (per core)    		 768 MB
    (96 MB per CCX)    		 SP3
    (up to) 2P    		 280 W
    EPYC 7763 $7890 2.45 3.40 256 MB
    32 MB per CCX    		 SP3
    (up to) 2P    		 280 W
    EPYC 7713 $7060 2.00 3.675 225 W
    EPYC 7713P $5010 SP3
    1P
    EPYC 7663 $6366 56 (112) 8 × 7 2.00 3.50 SP3
    (up to) 2P    		 240 W
    EPYC 7643 $4995 48 (96) 8 × 6 2.30 3.60 225 W
    EPYC 7573X $5590 32 (64) 8 × 4 2.80 3.60 768 MB
    (96 MB per CCX)    		 280 W
    EPYC 75F3 $4860 2.95 4.00 256 MB
    (32 MB per CCX)
    EPYC 7543 $3761 2.80 3.70 225 W
    EPYC 7543P $2730 256 MB
    (32 MB per CCX)    		 SP3
    1P
    EPYC 7513 $2840 2.60 3.65 128 MB
    (16 MB per CCX)    		 SP3
    (up to) 2P    		 200 W
    EPYC 7453 $1570 4 × CCD
    1 × I/OD    		 28 (56) 4 × 7 2.75 3.45 64 MB
    (16 MB per CCX)    		 225 W
    EPYC 7473X $3900 8 × CCD
    1 × I/OD    		 24 (48) 8 × 3 2.80 3.70 768 MB
    (96 MB per CCX)    		 240 W
    EPYC 74F3 $2900 3.20 4.00 256 MB
    (32 MB per CCX)
    EPYC 7443 $2010 4 × CCD
    1 × I/OD    		 4 × 6 2.85 4.00 128 MB
    (32 MB per CCX)    		 200 W
    EPYC 7443P $1337 SP3
    1P
    EPYC 7413 $1825 2.65 3.60 SP3
    (up to) 2P    		 180 W
    EPYC 7373X $4185 8 × CCD
    1 × I/OD    		 16 (32) 8 × 2 3.05 3.80 768 MB
    (96 MB per CCX)    		 240 W
    EPYC 73F3 $3521 3.50 4.00 256 MB
    (32 MB per CCX)
    EPYC 7343 $1565 4 × CCD
    1 × I/OD    		 4 × 4 3.20 3.90 128 MB
    (32 MB per CCX)    		 190 W
    EPYC 7313 $1083 3.00 3.70 155 W
    EPYC 7313P $913 SP3
    1P
    EPYC 72F3 $2468 8 × CCD
    1 × I/OD    		 8 (16) 8 × 1 3.70 4.10 256 MB
    (32 MB per CCX)    		 SP3
    (up to) 2P    		 180 W
    1. Core Complexes (CCX) × cores per CCX

    Zen 3+
    AMD Zen 3+
    General information
    LaunchedApril 1, 2022 (April 1, 2022)
    Designed byAMD
    Common manufacturer(s)
    Cache
    L1 cache64 KB (per core)
    L2 cache512 KB (per core)
    L3 cacheUp to 16 MB
    Architecture and classification
    Technology nodeTSMC N6
    Instruction setAMD64 (x86_64)
    Physical specifications
    Cores
    • 4 to 8
    Package(s)
      • Package FP7
      • Package FP7r2
    Product code name(s)
    • Thin & Light Mobile
      • Rembrandt
      • Rembrandt-R

    • High-End Mobile
      • Rembrandt
      • Rembrandt-R

    History
    Predecessor(s)Zen 3
    Successor(s)Zen 4
    Support status
    Supported

    Zen 3+ is the codename for a refresh of the Zen 3 microarchitecture, which focuses on power efficiency improvements. It was released in April 2022 with the Ryzen 6000 series of mobile processors.

    Features and improvements

    Zen 3+ has 50 new or enhanced power management features over Zen 3, and also provides an adaptive power management framework, as well as new deep sleep states. Altogether, this brings improvements to efficiency both during idle, and when under load, with up to 30% performance-per-watt increase over Zen 3, as well as longer battery life.[60][61]

    IPC is identical to that of Zen 3; the performance improvements of Ryzen 6000 over Ryzen 5000 mobile processors stem from it having a higher efficiency (hence more performance in power-constrained form factors like laptops), as well as the increased clock speeds from being built on the smaller TSMC N6 node.[62]

    The Rembrandt implementation of Zen 3+ also has support for DDR5 and LPDDR5 memory.

    Rembrandt

    On April 1, 2022, AMD released the Ryzen 6000 series of mobile APUs, codenamed Rembrandt. It introduces PCIe 4.0 and DDR5/LPDDR5 for the first time in an APU for the laptop and also introduced RDNA2 integrated graphics to the PC. It is built on TSMC's 6 nm node.[7]

    Common features of Ryzen 6000 notebook APUs:

    • Socket: FP7, FP7r2.
    • Zen 3+ architecture.
    • All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode.
    • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
    • L2 cache: 512 KB per core.
    • All the CPUs support 16 PCIe 4.0 lanes.
    • Includes integrated RDNA2 GPU.
    • Fabrication process: TSMC 6 nm FinFET.
    Branding and model CPU GPU TDP Release
    date
    Cores
    (threads)    		 Clock (GHz) L3 cache
    (total)    		 Core
    config[lower-roman 1]    		 Model Clock
    (GHz)    		 Config[lower-roman 2] Processing
    power[lower-roman 3]
    (GFLOPS)
    Base Boost
    Ryzen 9 6980HX 8 (16) 3.3 5.0 16 MB 1 × 8 Radeon
    680M    		 2.4 768:48:8
    12 CUs    		 3686.4 45 W Jan 4, 2022
    [63]
    6980HS 35 W
    6900HX[lower-alpha 1] 4.9 45 W
    6900HS[lower-alpha 1] 35 W
    Ryzen 7 6800H[lower-alpha 1] 3.2 4.7 2.2 3379.2 45 W
    6800HS[lower-alpha 1] 35 W
    6800U[lower-alpha 1] 2.7 15–28 W
    Ryzen 5 6600H[lower-alpha 1] 6 (12) 3.3 4.5 1 × 6 Radeon
    660M    		 1.9 384:24:8
    6 CUs    		 1459.2 45 W
    6600HS[lower-alpha 1] 35 W
    6600U[lower-alpha 1] 2.9 15–28 W
    1. Model also available as PRO version (6650U[lower-alpha 2], 6650H[lower-alpha 3], 6650HS[lower-alpha 4], 6850U[lower-alpha 5], 6850H[lower-alpha 6], 6850HS[lower-alpha 7], 6950H[lower-alpha 8], 6950HS[lower-alpha 9]), released on April 19, 2022.
    2. "AMD Ryzen 5 PRO 6650U". AMD.
    3. "AMD Ryzen 5 PRO 6650H". AMD.
    4. "AMD Ryzen 5 PRO 6650HS". AMD.
    5. "AMD Ryzen 7 PRO 6850U". AMD.
    6. "AMD Ryzen 7 PRO 6850H". AMD.
    7. "AMD Ryzen 7 PRO 6850HS". AMD.
    8. "AMD Ryzen 9 PRO 6950H". AMD.
    9. "AMD Ryzen 9 PRO 6950HS". AMD.
    1. Core Complexes (CCX) × cores per CCX
    2. Unified shaders : texture mapping units : render output units and compute units (CU)
    3. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

    Rembrandt-R

    Rembrandt-R is the codename for a refresh of Rembrandt codenamed processors, released as the Ryzen 7035 series of mobile APUs in January 2023.

    Common features of Ryzen 7035 notebook APUs:

    • Socket: FP7, FP7r2.
    • All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode.
    • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
    • L2 cache: 512 KB per core.
    • All the CPUs support 16 PCIe 4.0 lanes.
    • Includes integrated RDNA2 GPU.
    • Fabrication process: TSMC 6 nm FinFET.
    Branding and model CPU GPU TDP Release
    date
    Cores
    (threads)    		 Clock (GHz) L3 cache
    (total)    		 Core
    config[lower-alpha 1]    		 Model Clock
    (GHz)
    Base Boost
    Ryzen 7 7735HS 8 (16) 3.2 4.75 16 MB 1 × 8 680M
    12 CU    		 2.2 35–54 W Jan 4, 2023
    [64]
    7736U 2.7 4.7 15–28 W
    7735U 4.75 28 W
    Ryzen 5 7535HS 6 (12) 3.3 4.55 1 × 6 660M
    6 CU    		 1.9 35–54 W
    7535U 2.9 28 W
    Ryzen 3 7335U 4 (8) 3.0 4.3 8 MB 1 × 4 660M
    4 CU    		 1.8
    1. Core Complexes (CCX) × cores per CCX

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